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We present a high performance MPL-Decomposer to resolve the layout decomposition problem for multiple patterning lithography.
We present TPLPlace, a triple patterning lithography aware detailed placement solver.
We present DFI, a fill optimization framework with multiple objectives and constraints.
We present MrDP, a detailed placer that can handle multiple-row height cells in designs.
We present OpenMPL, an open-source multiple patterning layout decomposition framework for advanced multiple patterning lithography.