Experience

• Toshiba Memory Group, Ofuna, Japan
  • Internship
  • MLG team
  • May 2017 - August 2017, Ofuna, Japan
• IMEC, Leuven, Belgium
  • Internship
  • DETEX team
  • September 2016 - November 2016, Leuven, Belgium
• Chinese University of Hong Kong, China
  • Research Assistant
  • June 2016 - August 2016, Hong Kong, China
• Cadence Design Systems, Inc., USA
  • Internship
  • Software Engineering Intern
  • May 2015 - August 2015, Austin, TX
• Oracle Inc., USA
  • Internship
  • Processor Design Tools Group
  • Hardware Engineer Intern
  • May 2014 - August 2014, Austin, TX